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sensor solutions /// ms5536c page 1 09/2015 ms5536c smd gage pressure module specifications ? pressure range -400 to 1000 mbar (optional -1000 to 400 mbar) ? 0.1 mbar resolution ? factory calibrated (coefficients for software compensation store on-chip) ? 3-wire serial interface ? low voltage / low power ms5536c is a family of high-resolution factory calibrated pressure sensors. the devices include a piezoresistive pressure sensor and an adc-interface ic. the 3-wire serial interface ensures simple communication with any microcontroller. the devices provide digital pressure and temperature information as 16 -bit data word each. in addition 64-bit of individually calibrated compensation coefficients are stored allowing for a highly accurate software compensation of process spread and temperature effects. the devices have a very low standby current and automatically enter power down mode after each conversion. the optimu m compromise of refresh rate and average current consumption can be defined by the application software.
ms5536c smd gage pressure module sensor solutions /// ms5536c 09/2015 page 2 features ? 16 -bit adc resolution ? supply voltage 2.2 v to 3.6 v ? low supply current ? -40c to +85c ? small size ? no external components required applications ? medical application ? blood pressure meter ? air flow measurement ? hvac application block diagram vdd gnd mclk sclk dout din input mux adc digital interface memory (prom) 64 bits sensor sgnd +in -in dig. filter sensor interface ic fig. 1: block diagram ms5536c
ms5536c smd gage pressure module sensor solutions /// ms5536c 09/2015 page 3 pin configuration 1 2 3 4 5 6 7 14 13 12 11 10 9 8 1 2 3 4 5 6 7 14 13 12 11 10 9 8 top view bottom view fig. 2: pin configuration of ms5536-cpju, MS5536-CNJU pin description pin name pin type function n/c 1 not connected vdd 2 p positive supply voltage mclk 3 i master clock (32.768khz) din 4 i data input dout 5 o data output sclk 6 i serial data clock gnd 7 g ground n/c 8 not connected n/c 9 not connected n/c 10 not connected n/c 11 not connected n/c 12 not connected pv 13 n negative programming voltage pen 14 i programming enable note pins 13 (pen) and 14 (pv) are only used by the manufacturer for calibration purpo ses and should not be connected. pressure unit conversion mbar kpa bar mm hg psi atm mm h 2 o inches h 2 o 400.0 40.00 0.4000 300.0 5.801 0.3947 4079 160.57 1000.0 100.00 1.0000 750.0 14.503 0.9869 10198 401.45
ms5536c smd gage pressure module sensor solutions /// ms5536c 09/2015 page 4 absolute maximum ratings parameter symbol conditions min max unit notes supply voltage v dd -0.3 4 v differential overpressure p diff -5 5 bar 1, 2 cm overpressure p cm 10 bar 1, 3 storage temperature t s - 40 +125 c 1 notes 1) storage and operation in an environment of dry and non-corrosive gases. 2) for a differential sensor, differential pressure is the difference of pressure at port 1 minus pressure at port 2. for a gage sensor differential pressure is the difference of pressure at the port minus pressure of the ambient air. 3) for a differential sensor common mode pressure is the average of the pressure at port 1 and port 2. for a gage sensor common mode pressure is the average of the pressure at the port and the pressure of the ambient air. recommended operating conditions (ta = 25 c, v dd = 3.0 v unless noted otherwise) parameter symbol conditions min typ max unit supply voltage v dd 2.2 3.0 3.6 v supply current, average (1) during conversion (2) standby (no conversion) i avg i sc i ss v dd = 3.0 v 4 1 0.1 a ma a current consumption into mclk (3) mclk = 32.768 khz 0.5 a operating pressure range (4) p pressure range p devices - 400 1000 mbar operating pressure range (4) p pressure range n devices - 1000 400 mbar operating temperature range t a - 40 +25 +85 c conversion time t conv mclk = 32.768 khz 35 ms external clock signal (5) mclk 30.000 32.768 35.000 khz duty cycle of mclk 40/60 50/50 60/40 % serial data clock sclk 500 khz notes 1) under the assumption of one conversion every second. conversion means either a pressure or a temperature measurement started by a command to the serial interface of ms5536c. 2) during conversion the sensor will be switched on and off in order to reduce power consumption; th e total on time within a conversion is about 2 ms. the current specified is active only during this time. 3) this value can be reduced by switching off mclk while ms5536c is in standby mode. 4) positive pressure corresponds to higher pressure at port 1 (nozzle port on plastic cap). 5) it is strongly recommended that a crystal oscillator be used because the device is sensi tive to clock jitter. a square-wave form of the clock signal is a must.
ms5536c smd gage pressure module sensor solutions /// ms5536c 09/2015 page 5 electrical characteristics digital inputs parameter symbol conditions min typ max unit input high voltage v ih 80% v dd 100% v dd v input low voltage v il 0% v dd 20% v dd v signal rise time t r 200 ns signal fall time t f 200 ns digital outputs (t = -40 c .. 85 c v dd = 2.2 v .. 3.6 v) parameter symbol conditions min typ max unit output high voltage v oh i source = 0.6 ma 80% v dd 100% v dd v output low voltage v ol i sink = 0.6 ma 0% v dd 20% v dd v signal rise time t r 200 ns signal fall time t f 200 ns ad -converter (t = -40 c .. 85 c v dd = 2.2 v .. 3.6 v) parameter symbol conditions min typ max unit resolution 16 bit linear range 4'000 40'000 lsb conversion time mclk = 32.768 khz 35 ms inl within linear range -5 +5 lsb
ms5536c smd gage pressure module sensor solutions /// ms5536c 09/2015 page 6 pressure output characteristics with the calibration data stored in the interface ic of the ms5536c, the following characteristics can be achieved: (v dd = 3.0 v unless noted otherwise) parameter conditions min typ max unit notes resolution 0.1 mbar 1 pressure accuracy t a = 10 .. +40c ms5536-cpju: p = -100 .. 700 mbar MS5536-CNJU: p = -700 .. 100 mbar -2.5 +2.5 mbar 2 t a = 10 .. +40c ms5536-cpju: p = -400 .. 1000 mbar MS5536-CNJU: p = -1000 .. 400 mbar -9 +9 mbar 2 maximum error over temperature t a = - 40 .. +85c p = const. -7 +3 mbar 3 maximum error over supply voltage v dd = 2.2 .. 3.6 v -1.5 0 1.5 mbar 2 notes 1) a stable pressure reading of the given resolution requires taking the average of 2 to 8 subsequent pr essure values due to noise of the adc. 2) specified values assume an offset adjustment at any given pressure e.g. p = 0 prior to the m easurement. 3) specified values assume quadratic temperature compensation (refer to the paragraph "second-order temperature compensation" in the section "function"). temperature output characteristics the temperature information is not required for most applications, but it is necessary to allow for tem perature compensation of the output. reference temperature is 20 c. (v dd = 3.0 v unless noted otherwise) parameter conditions min typ max unit notes resolution 0.01 c accuracy at reference temperature -0.8 0.8 c 1, 2 t a = 10 .. +40c -1.5 1.5 c 1, 2 t a = -40 .. +85c -1.5 3 c 1, 2 maximum error over supply voltage v dd = 2.2 .. 3.6 v -0.2 0.2 c 2 notes 1) refer to the paragraph second-order temperature compensation in the section "function". 2) ? p=0
ms5536c smd gage pressure module sensor solutions /// ms5536c 09/2015 page 7 typical performance curves s adc-value d2 vs temperature (typical) 15000 20000 25000 30000 35000 40000 45000 50000 -40 -20 0 20 40 60 80 temperature (c) adc-value d2 (lsb) absolute pressure accuracy after calibration for ms5536-cpju -4 -2 0 2 4 6 8 10 12 -400 -300 -200 -100 0 100 200 300 400 500 600 700 800 900 1000 pressure (mbar) pressure error (mbar) 85c 60c 40c 20c 0c
ms5536c smd gage pressure module sensor solutions /// ms5536c 09/2015 page 8 s temperature error accuracy vs temperature (typical) -5 0 5 10 15 -40 -20 0 20 40 60 80 temperature (c) temperature error (c) temperature error (standard calculation) temperature error (with 2nd order calculation) pressure error accuracy vs temperature (typical) for ms5536-cpju -8 -6 -4 -2 0 2 4 6 8 10 12 14 16 18 -40 -20 0 20 40 60 80 temperature (c) pressure error (mbar) perror(600,1st order) perror(600,2nd order) perror(0,1st order) perror(0,2nd order)
ms5536c smd gage pressure module sensor solutions /// ms5536c 09/2015 page 9 pressure error vs supply voltage (typical) -1 -0.8 -0.6 -0.4 -0.2 0 0.2 0.4 0.6 0.8 1 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 voltage (v) pressure error (mbar) 600mbar 0mbar temperature error vs supply voltage (typical) -0.15 -0.1 -0.05 0 0.05 0.1 0.15 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 voltage (v) temperature error (c)
ms5536c smd gage pressure module sensor solutions /// ms5536c 09/2015 page 10 function general the ms5536c consists of a piezo-resistive sensor and a sensor interface ic. the m ain function of the ms5536c is to convert the uncompensated analogue output voltage from the piezo-resistive pr essure sensor to a 16-bit digital value, as well as providing a 16-bit digital value for the temperature of the sensor. measured pressure ( 16 -bit) d1 measured temperature (16-bit) d2 as the output voltage of a pressure sensor is strongly dependent on temperature and process tolerances, it is necessary to compensate for these effects. this compensation procedure must be perfor med by software using an external microcontroller. for both pressure and temperature measurement the same adc is used (sigma delta converter): ? for the pressure measurement, the differential output voltage from the pressure sensor is converted ? for the temperature measurement, the sensor bridge resistor is sensed and converted during both measurements the sensor will only be switched on for a very short tim e in order to reduce power consumption. as both, the bridge bias and the reference voltage for the adc are derived fro m v dd , the digital output data is independent of the supply voltage. factory calibration every module is individually factory calibrated at two temperatures and t wo pressures. as a result, 6 coefficients necessary to compensate for process variations and temperature variations are calculated and stored in the 64-bit prom of each module. these 64-bit (partitioned into four words of 16-bit) must be read by the microcontroller software and used in the program converting d1 and d2 into compensated pressure and temperature values. sensor d1 d2 word 1..4 calculation in external micro- controller pressure temperature
ms5536c smd gage pressure module sensor solutions /// ms5536c 09/2015 page 11 pressure and temperature measurement the sequence of reading pressure and temperature as well as of performing the software c ompensation is depicted in flow chart, fig. 3 and fig. 5. first word1 to word4 are read through the serial interface. this can be done once after res et of the microcontroller that interfaces to the ms5536c. next the compensation coefficients c1 to c6 are extracted using bit -wise logical- and shift-operations (refer to fig. 4 for the bit-pattern of word 1 to word 4). for the pressure measurement, the microcontroller has to read the 16-bit values for press ure (d1) and temperature (d2) via the serial interface in a loop (for instance once every second). then, the compens ated pressure is calculated out of d1, d2 and c1 to c6 according to the algorithm in fig. 3 (possi bly using quadratic temperature compensation according to fig. 5). all calculations can be performed with sig ned 16-bit variables. results of multiplications may be up to 32-bit long (+sign). in the flow according to fig. 3 each multiplication is followed by a division. this division can be performed by bit-wise shifting (divisors are to the power of 2). it is ensured that the results of these divisions are less than 65536 (16-bit). for the timing of signals to read out word1 to word4, d1, and d2 please refer to the paragraph seri al interface .
ms5536c smd gage pressure module sensor solutions /// ms5536c 09/2015 page 12 fig. 3: flow chart for pressure and temperature reading and software c ompensation notes 1) readings of d2 can be done less frequently, but the display will be less stable in this c ase 2) for a stable display of 0.1 mm hg resolution or below, it is recommended to displa y the average of at least 8 subsequent pressure values. system initialisation pressure and temperature measurement example: word1, word2, word3 and word4 (4x16 bit) d1 = 15832 d2 = 28877 start convert calibration data into coefficients: (see bit pattern of word1-word4) read calibration data (factory calibrated) from prom of ms5536c display pressure and temperature value basic equations: calculate temperature compensated pressure di fference between actual temperature and reference temperature: dt = d2 - ut1 actual temperature: temp = 2000 + dt*(c6+262)/2 9 (weight: 0.01c) calculate actual temperature senst1 offt1 tcs tc o t ref tempsens c1: pressure sensitivity (13 bit) c2: pressure offset (13 bit) c3: temperature coefficient of pressure sensitivity (9 bit) c4: temperature coefficient of pressure offset (9 bit) c5: reference temperature (12 bit) c6: temperature coefficient of the temperature (8 bit) word1 = 45834 word2 = 61787 word3 = 49110 word4 = 4060 c1 = 4054 c2 = 4060 c3 = 179 c4 = 241 c5 = 2826 c6 = 91 dt(d2) = d2 - t ref temp(d2)=20+dt(d2)*tempsens offset at actual temperature: off = c2 +10381+ ((c4-243)*dt)/2 12 sensitivity at actual temperature: sens = c1 + 10179+((c3+222)*dt)/2 11 x = (sens * (d1-off))/2 12 temperature compensated pressure: p = 2x (weight: 0.01mmhg) p = x*1365/2 9 (weight: 0.01mbar) off(d2)=offt1+tco*dt(d2) sens(d2)=senst1+tcs*dt(d2) p(d1,d2)= sens(d2)*(d1- off(d2)) dt = 2437 temp = 3680 = 36.80 c off = 14440 sens = 14710 x = 4999 p = 9998 = 99.98 mmhg ut1= 26440 28877 read digital pressure value from ms5536c d1 (16 bit) calculate calibration temperature ut1=4*c5+15136 read digital temperature value from ms5536c d2 (16 bit)
ms5536c smd gage pressure module sensor solutions /// ms5536c 09/2015 page 13 c3/ii (8-bit) c5/ii(8-bit) word 1 db7 db6 db5 db4 db3 db2 db1 db0 db7 db6 db5 db4 db3 db2 db1 db0 c4/ii (8-bit) c6(8-bit) word 2 db7 db6 db5 db4 db3 db2 db1 db0 db7 db6 db5 db4 db3 db2 db1 db0 c5/i (4-bit) c1/ii (12-bit) word 3 db11 db10 db9 db8 db11 db10 db9 db8 db7 db6 db5 db4 db3 db2 db1 db0 c1/i c4/i c3/i c2 (13-bit) word 4 db12 db8 db8 db12 db11 db10 db9 db8 db7 db6 db5 db4 db3 db2 db1 db0 fig. 4: arrangement (bit-pattern) of calibration data in word1 to wo rd4 second-order temperature compensation in order to obtain full accuracy over the whole temperature range, it is recommended to compensate for the non- linearity of the output of the temperature sensor. this can be achieved by t he second-order temperature calculation, i.e. by replacing the block calculate actual temperature in flow chart fig . 3 by the following sequence: calculate actual temperature difference between the actual temperature and reference temperature: dt = (d2 - ut1) - ((d2-ut1)*(d2-ut1))/2 18 actual temperature in c temp = 2000 + dt*(c6+262)/2 9 (weight: 0.01c) calculate actual temperature difference between the actual temperature and reference temperature: dt = (d2 - ut1) - (9*(d2-ut1)*(d2-ut1))/2 18 actual temperature in c temp = 2000 + dt*(c6+262)/2 9 (weight: 0.01c) d2 ? ut1? no yes fig. 5: flow chart for calculating the temperature to the optimum ac curacy. the value for dt thus obtained is then used for the calculation of the temperature compensated pressure as shown in f ig. 3.
ms5536c smd gage pressure module sensor solutions /// ms5536c 09/2015 page 14 serial interface the ms5536c communicates with microprocessors and other digital systems via a 3-wire synchronous serial interface as shown in fig. 1. the sclk (serial clock) signal initiates the communication and synchronizes the data transfer with each bit being sampled by the ms5536c on the rising edge of sclk and each bit being sent by the ms5536c on the rising edge of sclk. the data should thus be sampled by the microcontrol ler on the falling edge of sclk and sent to the ms5536c with the falling edge of sclk. the sclk-signal is generated by the microprocessors system. the digital data provided by the ms5536c on the dout pi n is either the conversion result or the software calibration data. in addition the signal dout (data out) is also used to indicate the conversion status (conversion-ready signal, see below). the selection of the outpu t data is done by sending the corresponding instruction on the pin din (data input). following is a list of possible output data instructions: ? conversion start for pressure measurement and adc- data -out d1 (figure 6a) ? conversion start for temperature measurement and adc- data -out d2 (figure 6b) ? ca libration data read-out sequence for word 1 and word 3 (figure 6c) ? calibration data read-out sequence for word 2 and word 4 (figure 6d) ? reset sequence (figure 6e) every communication starts with an instruction sequence at pin din. fig. 6 sho ws the timing diagrams for the ms5536c. the device does not need a chip select signal. instead there is a start sequence (3 -bit high) before each setup sequence and stop sequence (3-bit low) after each setup sequence. t he setup sequence consists in 4-bit that select a reading of pressure, temperature or calibration data. in case of press ure- (d1) or temperature- (d2) reading the module acknowledges the start of a conversion by a low to high tran sition at pin dout during the last bit of the stop sequence. two additional clocks at sclk are required after the acknowledge signal. then s clk is to be held low by the microcontroller until a high to low transition on dout indicates the end of the conversion. this signal can be used to create an interrupt in the microcontroller. the microcontroller m ay now read out the 16- bit word by giving another 17 clocks on the slck pin. it is possib le to interrupt the data read-out sequence with a hold of the sclk signal. it is important to always read out the last conversion result before starting a new conversion. the reset-sequence is special as its unique pattern is recognized by the module in any state. by consequence it can be used to restart if synchronization between the microcontroller and the ms55 36c has been lost. this sequence is 21-bit long. the dout signal might change during that sequence (see fig. 6e). it is r ecommended to send the reset sequence before first conversion sequence to avoid hanging up the protocol permanently in case of electrical interference. sequence: start+p-measurement sclk dout din bit7 conversion start for pressure measurement and adc-dat a-out "d1": end of conversion bit6 bit5 bit4 bit3 bit2 bit1 bit0 conversion (33ms) db7 adc-data out msb adc-data out lsb bit8 bit9 start-bit stop-bit db6 db5 db4 db3 db2 db1 db0 db7 db6 db5 db4 db3 db2 db1 db0 start of conversion setup-bits fig. 6a: d1 acquisition sequence
ms5536c smd gage pressure module sensor solutions /// ms5536c 09/2015 page 15 sequence: start+t-measurement sclk dout din bit7 conversion start for temperature measurement and adc-da ta-out "d2": end of conversion bit6 bit5 bit4 bit3 bit2 bit1 bit0 conversion (33ms) bit8 bit9 start-bit stop-bit setup-bits start of conversion db7 adc-data out msb adc-data out lsb db6 db5 db4 db3 db2 db1 db0 db7 db6 db5 db4 db3 db2 db1 db0 fig. 6b: d2 acquisition sequence sequence: coefficient read + address sclk dout din bit7 calibration data read out sequence for word 1/ word 3: bit6 bit5 bit4 bit3 bit2 bit1 bit0 db7 coefficient-data out msb coefficient-data out lsb bit8 bit9 start-bit stop-bit db6 db5 db4 db3 db2 db1 db0 db7 db6 db5 db4 db3 db2 db1 db0 bit10bit11 address word 1 address word 3 setup-bits fig. 6c: word1, word3 reading sequence address word 2 address word 4 sequence: coefficient read + address sclk dout din bit7 calibration data re ad out sequence for word 2/ word 4: bit6 bit5 bit4 bit3 bit2 bit1 bit0 db7 coefficient-data out msb coefficient-data out lsb bit8 bit9 start-bit stop-bit db6 db5 db4 db3 db2 db1 db0 db7 db6 db5 db4 db3 db2 db1 db0 bit10bit11 setup-bits fig. 6d: w2, w4 reading sequence sequence: reset sclk dout din bit7 reset - sequence: bit6 bit5 bit4 bit3 bit2 bit1 bit0 bit8 bit9 bit10bit11bit12bit13bit14bit15 bit16bit17bit18bit19bit20 fig. 6e: reset sequence (21 bit)
ms5536c smd gage pressure module sensor solutions /// ms5536c 09/2015 page 16 application information general the ms5536c consists in a sensor die and a mixed signal interface ic on a singl e ceramic substrate with pb-free leads attached. it is compatible with standard pcb-assembly technologies (pi ck and place followed by ir-reflow soldering). single sided pcb layout is possible. the device directly interfaces to a standard microcontroller, no costly external components like instrumentation amplifiers or a/d converters are required . a mark on the ceramic substrate indicates pin 1 (see fig. 2). the silicon pressure transducer, the ic and the bonding wires are protected against humi dity by a silicone gel and against mechanical damage by a plastic cap. the cap is also used as the pressure port. the ms5536c does not show pressure hysteresis effects. the simple digital 3 wire synchronous serial interface eliminates all sensitive analogue signal lines on the pcb with their often critical routing and guarding issues. the protocol does not req uire specific interface cells and can be implemented on any microcontroller using standard i/os. the required external clock-signal of 32.768 khz is standard in the watch industry and readily available in most hand-held applications. the ms5536c is well suited for battery powered portable devices. this is due to the low supply voltage of 2.2v and the small amount of computing power required to calculate the compensated values f or pressure and temperature (use of 4-bit microcontrollers is possible). no costly end- of -line calibrations are required as the ms5536c contains factory stored calibration coefficients. in order to further enhance accuracy it is recommended to periodically recalibrate the dev ice offset in the application blood pressure meters with vent open). the detected difference between displayed and actual pressure can be memorized and subtracted from following readings. the pressure range and port configurations make the ms5536c well suited for application s like blood-pressure metering, air flow and pressure measurements in hvac-systems and liquid level detection. 4/8bit-microcontroller lcd-display eeprom keypad ms5536c sclk din dout mclk xtal1 xtal2 32.768 khz optional vdd gnd vdd gnd 3v -battery 47 f tantal fig. 7: application example of the ms5536c for a battery powered device
ms5536c smd gage pressure module sensor solutions /// ms5536c 09/2015 page 17 device package outlines all dimensions in mm fig. 8: device package outlines of ms5536-cpju / MS5536-CNJU pad layout for ms5536-c all dimensions in mm [inch] fig. 9: recommended pad-layout for ms5536-cpju / MS5536-CNJU 10.8 [0.425] 1.3 [0.051] 0.7 [0.028] 1.27 [0.050]
ms5536c smd gage pressure module sensor solutions /// ms5536c 09/2015 page 18 assembly decoupling capacitor particular care must be taken when connecting the device to power supply. a 47 f tantalum cap acitor must be placed as close as possible of the ms5536c's vdd pin. this capacitor will stabilise the power sup ply during data conversion and thus, provide the highest possible accuracy. soldering please refer to the application note an808 for all soldering issues. mounting the ms5536c can be placed with automatic pick&place equipment using a special vacuum nozzle. it will not be damaged by the vacuum. for a good mechanical stability, it is important to solder all contact pads. the pins pen and pv must be left open or connected to vdd. do not connect to gnd! light sensitivity the ms5536c is protected against sunlight by the cap on front side. it is, however, i mportant to note that the sensor may still be slightly sensitive to sunlight, especially to infrared light sources (light may also enter the negative pressure port on backside). this is due to the strong photo effect of silic on. as the effect is reversible there will be no damage, but the user has to take care that in the final product the sensor cannot be exposed t o direct light during operation. this can be achieved for instance by placing mechanical parts with holes in such that l ight cannot pa ss. connecting the pressure port the best connection to the pressure port is achieved with a flexible tube fitted to th e full length of the nozzle. care should be taken to keep the nozzle clean. the tube should be flexible enough to minimize the mechanical stress on the module (see fig. 10) fig. 10: connection to pressure port
ms5536c smd gage pressure module sensor solutions /// ms5536c 09/2015 page 19 cleaning the ms5536c has been manufactured under cleanroom conditions. it is therefore recommen ded to assemble the sensor under class 10000 or better conditions. should this not be possible, it is recommended to protect the sensor opening during assembly from entering particles and dust. to avoid cleaning of the pcb, solde r paste of type no - clean shall be used. cleaning might damage the sensor! esd precautions the electrical contact pads are protected against esd up to 4 kv hbm (human body model). it is therefore essential to ground machines and personal properly during assembly and handling of the d evice. the ms5536c is shipped in antistatic transport boxes. any test adapters or production transport boxes us ed during the assembly of the sensor shall be of an equivalent antistatic material. ordering information product code product art. no package comments ms5536-cpju smd gage pressure module rohs 325536008 gage with plastic cap, upright nozzle, vent hole on backside, j-lead type pressure range (port1 C port2): - 400 mbar +1000 mbar MS5536-CNJU smd gage pressure module rohs 325536009 gage with plastic cap, upright nozzle, vent hole on backside, j-lead type pressure range (port1 C port2): - 1000 mbar +400 mbar te.com/sensorsolutions measurement specialties, inc., a te connectivity company. measurement specialties, te connectivity, te connectivity (logo) and ev ery connection counts are trademarks. all other logos, products and/o r company names referred to herein might be trademarks of their respective owners. the information given herein, including drawings, illustrations an d schematics which are intended for illustration purposes only, is beli eved to be reliable. however, te connectivity makes no warranties as to its accuracy or completeness and disclaims a ny liability in connection with its use. te connectivitys ob ligations shall only be as set forth in te c onnectivitys standard terms and conditions of sale for this product and in no case will t e connectivity be liable for any incidental, indirect or consequ ential damages arising out of the sale, resale, use or misuse of the product. users of te connectivity products should make their own evalua tion to determine the suitability of each such product for the specific ap plication. ? 2015 te connectivity ltd. family of companies all rights reserved. da5536c_005 0005536c1245 ecn1511 north america measurement specialties, inc., a te connectivity company 45738 northport loop west fremont, ca 94538 tel: +1 800 767 1888 fax: +1 510 498 1578 e-mail: pfg.cs.amer@meas-spec.com website: www.meas-spec.com europe measurement specialties (europe), ltd., a te connectivity company switzerland srl ch. chapons-des-prs 11 ch -2022 bevaix tel: +41 32 847 9550 fax: + 41 32 847 9569 e-mail: sales.ch@meas-spec.com website: www.meas-spec.com asia measurement specialties (china), ltd., a te connectivity company no. 26 langshan road shenzhen high-tech park (north) nanshan district, shenzhen, 518057 china tel: +86 755 3330 5088 fax: +86 755 3330 5099 e-mail: pfg.cs.asia@meas-spec.com website: www.meas-spec.com

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